Helion Signs Letter of Intent for $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D To Support Fusion Energy
Helion, building the world's first fusion powerplant, led by David Kirtley and the team, has signed a letter of intent with the U.S. Department of Commerce to receive up to $175 million in funding through the CHIPS Research and Development Office to conduct R&D critical for the development and manufacturing of next-generation semiconductor technologies for commercial fusion energy. The expected federal award will be accompanied by $50 million in additional private investment and will support new semiconductor research, manufacturing, and advanced-packaging capabilities in the U.S.
“Building fusion power plants at scale requires us to accelerate the development of technologies like semiconductors that are critical to making fusion possible,” said David Kirtley, CEO of Helion. “This award combined with additional private investment, totaling $225 million, will allow Helion to develop and manufacture advanced semiconductors here in the United States that deliver the efficiency, reliability, and performance our systems require. It’s an important investment in both America’s semiconductor manufacturing base and the future of commercial fusion.”
Helion’s CHIPS Act Award will support U.S.-based R&D and manufacturing of next-generation high-voltage semiconductors for its fusion systems. Designed for greater efficiency, longer operating life, and improved cooling, these components aim to reduce costs, strengthen reliability, and limit dependence on overseas suppliers as Helion advances toward commercial deployment.
“The Trump Administration is accelerating American semiconductor innovation to enhance our domestic energy and power resources,” said Secretary of Commerce Howard Lutnick. “This investment expands domestic research, secures critical supply chains, and creates high-paying American jobs.”
Helion’s funding will support more than $100 million in semiconductor R&D and advanced packaging in Everett, Washington, creating over 100 jobs and expanding power module manufacturing. Another $80 million will fund semiconductor tooling, design, and process development in Burlington, Vermont, with additional investment in packaging innovations and manufacturing automation to strengthen the domestic supply chain for fusion power plants.
“This CHIPS R&D award will support innovation in next-generation semiconductor power modules and devices critical to advancing fusion energy,” said Bill Frauenhofer, Executive Director of Semiconductor Investment and Innovation at the Department of Commerce. “Accelerating this R&D domestically will support breakthroughs in America’s ability to convert and deliver power to critical applications in defense, grid transmission, and advanced energy generation.”
Helion’s CHIPS Act Award could accelerate U.S. fusion energy development, with the Department of Commerce set to receive a $175 million non-voting interest in the company under the definitive award agreement. The announcement follows key milestones, including a $500 million Series G funding round, a reported breakthrough in deuterium-tritium fusion at 150 million degrees Celsius, and continued progress on Orion, Helion’s first planned fusion power plant.
